Join Microsoft's Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) team, the driving force behind our expansive Cloud Infrastructure. We power Microsoft's "Intelligent Cloud" mission, providing the core technologies for over 200 online businesses including Azure, Office 365, and Xbox Live. Our commitment is to smart growth, high efficiency, and delivering a trusted global experience. We are actively seeking passionate engineers to contribute to our mission and shape the future of cloud infrastructure.

As a Physical Design Engineer, you will be instrumental in the end-to-end physical design implementation and integration of cutting-edge semiconductor products. Your responsibilities will span block, subsystem, sub-chip, and full-chip levels. This includes crucial tasks such as floorplanning, synthesis, placement, clock tree synthesis, routing, static timing analysis, physical verification, formal equivalency checks, power efficiency optimization, IR-drop analysis, and EM analysis. Opportunities to develop and automate physical design flows, as well as evaluate and recommend technology, IP, and vendor selections, are also part of this role. You are expected to work independently, maintain meticulous attention to detail, and provide clear, concise status updates on progress, issues, and risks to management.

We require a Bachelor's or Master's degree in Electrical or Computer Engineering, or a related field, coupled with over 8 years of professional experience. Essential expertise includes physical design implementation and signoff at block, sub-system, sub-chip, and SoC levels, along with a proven track record of tapeouts for complex ASICs utilizing leading-edge technologies. Please note, this position involves access to export-controlled information, requiring verification of citizenship or residency status as a condition of employment.