Join Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) as a Principal Physical Design Engineer. SCHIE is instrumental in powering Microsoft’s expanding cloud infrastructure, supporting over 200 online businesses including Azure, Office 365, and Xbox Live. Our mission focuses on smart growth, high efficiency, and delivering trusted experiences worldwide. We are seeking passionate engineers to drive the future of our cloud infrastructure.

As a key contributor to our semiconductor design team, you will lead physical design implementation and integration efforts for cutting-edge products. Your responsibilities span block, subsystem, sub-chip, and full-chip levels, encompassing tasks such as floorplanning, synthesis, placement, CTS, routing, static timing analysis, physical verification, formal equivalency, power efficiency, IR-drop, and EM analysis. You will also play a role in physical design flow automation, technology, IP, and vendor selection. Drive PD teams to achieve quality results and meet milestone goals, working with limited direction and providing clear status updates on progress, issues, and risks.

We seek candidates with a Bachelor's or Master's degree in Electrical or Computer Engineering, or a related field, coupled with over 12 years of experience in physical design implementation and signoff at various levels (block, sub-system, sub-chip, SoC). Proven experience with complex ASIC tapeouts in leading-edge technologies and a track record of leading teams to achieve planned PD goals are essential. This role may involve occasional travel.