Join Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) to power the future of cloud infrastructure and accelerate Intelligent Cloud vision. SCHIE is pivotal in delivering foundational technologies for over 200 Microsoft services, including Azure and Microsoft 365.

Within SCHIE, the Methodology, Infrastructure & Labs Engineering (MILE) organization drives Microsoft's silicon strategy. MILE is responsible for end-to-end silicon design methodologies, EDA/CAD ecosystems, and the compute infrastructure for custom silicon like Azure Cobalt and Azure Maia processors.

We are seeking a distinguished Silicon Engineering leader to spearhead our Physical Design Methodology & CAD team in India. This pivotal role involves building and guiding a top-tier team focused on defining and advancing physical design methodologies, sign-off solutions, CAD strategy, and flow architecture for Microsoft's silicon programs. Collaborate globally to deliver scalable, innovative, and robust solutions that accelerate silicon development.

Cultivate and lead a premier Physical Design Methodology & CAD team in India, emphasizing innovation, technical mastery, and continuous growth.

Collaborate with global engineering leaders to shape and implement the long-term strategy for Physical Design methodologies and CAD solutions, ensuring successful delivery of next-generation silicon products.

Drive advanced RTL-to-GDSII flows, robust automation frameworks, and effective design closure solutions for predictable execution and first-pass silicon success.

Spearhead the AI-driven transformation of physical design methodologies, CAD flows, and engineering infrastructure. Integrate cutting-edge AI, machine learning, and automation technologies to dramatically enhance productivity, quality, and engineering velocity.

Partner with cross-functional engineering leaders (architecture, design, verification, infrastructure, program management) to deliver complex SoCs on schedule, promoting scalable and efficient development practices.

Influence industry advancements through close collaboration with leading EDA vendors, pushing the boundaries of next-generation design technologies, methodology innovation, and operational excellence across Microsoft's silicon ecosystem.

Champion quantifiable improvements in quality, productivity, compute efficiency, cost optimization, and overall engineering effectiveness throughout the silicon development lifecycle.

A Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical discipline is required.

Possess over 12 years of comprehensive experience in Physical Design, CAD, EDA, or Silicon Engineering, with profound expertise in semiconductor design methodologies and workflows.

Demonstrate at least 5 years of leadership experience, including building and developing engineering teams, mentoring technical leads and senior engineers, and fostering a high-performance engineering culture.

Proven track record in defining, constructing, and scaling CAD methodologies, automation frameworks, and engineering workflows essential for complex SoC and ASIC development programs.

Exhibit success in influencing and aligning stakeholders across globally distributed engineering teams to drive cross-functional initiatives and successfully deliver complex silicon programs.

Showcase a demonstrable impact on driving engineering excellence through strategic investments in methodology, automation, infrastructure, and tooling that enhance productivity, quality, predictability, and time-to-market.